30 - 31 January 2018 / Kgs. Lyngby, Denmark

Agenda

The event agenda's time zone is CEST.

Final programme

Tue
30 Jan 2018
08:30 – 09:00
Registration and coffee
09:00 – 09:45
Introduction to the seminar and Humidity effects in electronics and reliability issues

Rajan Ambat 
Center for Electronic Corrosion,
Technical University of Denmark

09:45 – 10:20
Environment-induced corrosion of wire bonds in Microelectronics

Orla O’Halloran
NXP semiconductors 
Netherlands 

10:20 – 10:55
Interaction of Liquids with Electronic Systems: Thermal Events

Katharina Schultz 
Automotive Electronics 
Robert Bosch
Germany

10:55 – 11:20
Coffee break
11:20 – 11:55
Indoor aerosol and gas chemistry: a challenge/risk for electronic reliability

Luca Ferrero

University of Milan-Bicocca, Italy 

11:55 – 12:30
An overview of electrochemical corrosion on lead-free solder alloys

Bálint Medgyes
BME Budapest  

12:30 – 13:30
Lunch break

Building 202

13:30 – 14:05
Electrochemical failure mechanisms at the semiconductor-packaging interface

Sophie Mach
Automotive Electronics
Robert Bosch
Germany

14:05 – 14:40
Electrochemical migration in automotive PCBA

Rosanne GRAVINA

PhD, Renault Group, France

14:40 – 15:15
Outgassing in Polymers – Analysis and Consequences for Functional Foils

Allan Hjarbæk Holm
Grundfos
Denmark

15:15 – 15:40
Coffee break
15:40 – 16:15
Reliability Assessment of No-clean and Water-soluble Solder Pastes

Mélanie Mathon
Inventec
France 

16:15 – 16:50
Short time Corrosion tests for electronic materials using thin layer coupons

Lutz Muller
Robert Bosch
Germany

16:50 – 17:35
Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering

Emmanuelle Guéné
Inventec
France

17:35 – 17:45
Concluding remarks for first day

Rajan Ambat
Center for Electronic Corrosion,
Technical University of Denmark

18:00 – 20:00
DTU 202
Casual dinner and networking

There will be tapas and drinks in the beautiful new building of DTU (~50 m from the seminar venue). This is the same location as the the network meetings will be held.

18:15 – 19:30
DTU Building 202
Match making event

Please note that we have changed the start time of the networking/ matchmaking session, in order to ensure proper time between the seminar, dinner and networking.

Wed
31 Jan 2018
08:30 – 09:00
Arrival and coffee
09:00 – 09:35
Corrosion phenomena in automotive electronics

Oliver Senftleben 

Audi, Germany   

09:35 – 10:10
Reliability aspects - from global to local load

Steffen Seifritz  
Corporate Research, Robert Bosch, Germany

10:10 – 10:45
Modelling humidity-driven PCB board-level failure mechanisms


Natalie Hernandez

DFR solutions, USA

10:45 – 11:10
Coffee break
11:10 – 11:45
Humidity build up in electronic enclosures and defining design parameters

Helene Conseil
Center for Electronic Corrosion, Technical University of Denmark 

11:45 – 12:20
Simulation approach for thermal and moisture management of electronics

Sankhya Mohanty
Process Modelling Group,
Technical University of Denmark

12:20 – 13:20
Lunch break

Building 202

13:20 – 13:55
Humidity testing at Device level and analysis of failure modes

Kim Schmidt
Force Technology, Denmark

Morten Jellesen
Center for Electronic Corrosion, Technical University of Denmark

13:55 – 14:30
Trends in conformal coating processing

Lars Nielsen
Nordson Asymtek 

14:30 – 15:05
Surface Insulation Resistance testing of conformal coatings used in electronics

Laura Frisk
Trelic, Finland 

15:05 – 15:40
Investigation of conformal coatings using electrochemical techniques

Morten Jellesen and Vadimas Verdingovas

CELCORR, DTU


15:40 – 15:55
Conclusion and end of seminar

Rajan Ambat
Center for Electronic Corrosion,
Technical University of Denmark


The event agenda's time zone is CEST.